產業類別:
微奈米級電極用銅粉
微奈米級電極用銅粉
太陽能導電漿料未來趨勢→銅粉取代銀粉
F-Cu: Front Copper Metallization Powder
NAME:SYP-CUK
Specific Surface Area:5.0±0.5 M2/g
Apparent Density:1.6±0.5 g/c.c

AG PRO 銅粉100%自主性技術

太陽能導電漿料未來趨勢→銅粉取代銀粉

銀品科技具備銅粉研發與生產技術,未來將不斷創新與研發以符合產業趨勢

 

 

 

Source: International Technology Roadmap for Photovoltaic’s Result 2013, PV Group,
Second Edition March, 2014

 

產品應用:

優點: 

(1)BET≧5.0 M2/g 
(2)粒徑小且集中;緻密度高且耐壓好 
(3)可降低燒結溫度(800℃~900℃),減少燒結能源耗材成本 

Main Appication: 

(1)陶瓷高功率電路導線 
(2)積層陶瓷晶片元件內外電極
(3)晶矽太陽能電池正面銅漿與背面銅漿

銅粉EDS圖

5        8



 

SEM圖

 

 CuK01

6
MP-CuK-01-x50000

4553
MP-CuK-01-x1000

52475
MP-CuK-01-x5000

65
MP-CuK-01-x10000

53
MP-CuK-01-x20000

53
MP-CuK-01-x50000

1
MP-CuK-01-x1000

5
MP-CuK-01-x5000

5
MP-CuK-01-x10000

5
MP-CuK-01-x20000

 CuP01

515
CuP-01

55
CuP-01-x1000

55
CuP-01-x5000

5151
CuP-01-x10000

55
CuP-01-x20000

5151
MP-CuP-01-x50000

88MP-CuP-01-x1000

5MP-CuP-01-x5000

55MP-CuP-01-x10000

5MP-CuP-01-x20000

 

 CuS12

1
CuS-12

55CuS-12-x1000

5351CuS-12-x5000

154CuS-12-x10000

53CuS-12-x20000

545
MP-CuS12-x5000-2

2MP-CuS12-x1000

1MP-CuS12-x5000

2MP-CuS12-x10000

5MP-CuS12-x20000

 CuS30

15
CuS-30

1CuS-30-x1000

151CuS-30-x5000

53CuS-30-x10000

5CuS-30-x20000

55
MP-CuS-30-x50000

15MP-CuS-30-x1000

11MP-CuS-30-x5000

15MP-CuS-30-x10000

1MP-CuS-30-x20000

 RCuS25

45
RCuS-25

2RCuS-25-x1000

212RCuS-25-x5000

1RCuS-25-x10000

1RCuS-25-x20000

15
MP-RCuS-25-x50000

1MP-RCuS-25-x1000

15MP-RCuS-25-x5000

5MP-RCuS-25-x10000

51MP-RCuS-25-x20000

 RCuS30

52
RCuS-30

15RCuS-30-x1000

5RCuS-30-x5000

4RCuS-30-x10000

15RCuS-30-x20000

5
MP-RCuS-30-x50000

15MP-RCuS-30-x1000

51MP-RCuS-30-x5000

51MP-RCuS-30-x10000

15MP-RCuS-30-x20000

 FCuS30

51
FCuS-30

15FCuS-30-x1000

15FCuS-30-x5000

5FCuS-30-x10000

53FCuS-30-x20000

15MP-FCuS-30-x50000

15MP-FCuS-30-x1000

53MP-FCuS-30-x5000

53
MP-FCuS-30-x10000

51
MP-FCuS-30-x20000




5




5




銀品科技粉末核心技術並持續帶來創新科技,
為銀漿帶來高固含量及細線化優勢,以降低製程成本並有良好印刷線性。
期望客戶與銀品共同合作高效能銀漿
     並共同攜手迎向銅漿未來,共創雙贏。




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