Industry:
Spherical Silver Powder
Nano, Sub micro, Micro metal powder-Silver Powder, Copper Powder for Electronic Materials
Metal Powder&Customized Product
Nano, Sub micro, Micro metal powder-Silver Powder, Copper Powder for Electronic Materials
/
Silver flake
2019 Catalogue of Silver Flake
Application
Metallization pastes for electronic components
Mean
Particle
Particle Distribution(μ)
D10 D50 D90 Dmax
T.D.
g/cm3
Product Name
AG F 150
8.58μm
2.5 7.3 16.4 39.23
3.2
AG F 168
≦4.0μm
1.8 3.7 7.4 17.37
3.5
AG F 230
≦4.0μm
1.8 3.6 6.6 15.17
4.1
AG F 186
5.49μm
2.3 4.8 9.4 26.11
3.4
PF130
4.00μm
1.1 3.2 8.1 17.38
2.4
981-200
8-10μm
2.0 6.7 16.9 44.94
4.0
981-300
8-10μm
2.4 7.3 20.0 58.95
5.3
982-210
8-10μm
2.6 8.0 19.7 58.95
4.0
TEL:886-6-3557305
FAX:886-6-3559814
E-Mail:agpro@agpro.com.tw
HIT:00083939
Design by
TNDG