Industry:
Spherical Silver Powder
Nano, Sub micro, Micro metal powder-Silver Powder, Copper Powder for Electronic Materials
Metal Powder&Customized Product
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Silver Conductive Adhesive Paste
Silver Conductive Adhesive Paste
Single component type and double-components type silver filled Epoxy based paste for die attach
Product
Ingredient
Solid Content
Viscosity
Curing Condition
LBS
Ag
>99%
45±5 kcps
150
℃*30min
AB
Ag
>99%
40±5 kcps
(1)
Air curing
(2)
60
℃*180min
(3)
80
℃*60 min
(4)
150
℃*10min
TEL:886-6-3557305
FAX:886-6-3559814
E-Mail:agpro@agpro.com.tw
HIT:00084024
Design by
TNDG